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Ultra High Density (Rigid / Flex / Flex Rigid) – HDI (High Density Interconnection) – Micro Via types / Buried Via / Via Filling / Buried Capacitors / Resistance / Via on PAD - Filling / PCB Cavity / Thermal Heat PCB dissipation. EMC - Design for low-noise, low-emission, and high-immunity (EN55022, EN55024, and NEBS (GR1089) requirements). Signal Integrity - reference-levels (power and ground bounce) / noise across PCB power distribution, Crosstalk, Reflections. MCM – IC’s Miniaturization Substrate / Ultra Micro Electronics PCB Design. Mother Board High Speed Backplane Design.

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