Engineering / Assembly Process

Printed Circuit Board Assembly Flex PCB, Flex Rigid, Hybrid (Mix Materials) Inviatech works with a wide range of PCB Assembly house (across the global) to ensure that orders can meet in a time-efficient and High Quality. We can offer our expertise to hit your target for Time to market as well for the best Quality - Highest Production yield NPI - New Products introduction PCB (Development Proto Type)   Mass Production PCB Assembly Technological and Engineering Assembly Process Control and Quality New Product introduction Process Validation, QA / QC – Attendance at the Customer Subcontractor   Pre Production Technological Management (Set up, Component MSL, SMT Line Preparation) Expertise: Solder Paste Stencil Aperture and Parameters Design Solder Paste Specification and Handling, Stencil machinery parameters Reflow oven Soldering - Lead free / laded / Mix - Reflow Profile technological set up design Expertise with BGA, Micro-BGA, QFN, Flip Chip, DFN, Power Modules, LGA, POP – Package on Package Surface mount Technology 5DX / X-Ray Analysis Special Rework local Reflow profiling (Temperature Managements) Re - Balling of BGA terminals, Die attachment and Wire Bonding Hot bar soldering Flex circuit to Rigid printed circuit boards Thru-Hole Technology- Selective Wave, Solder Paste Intrusion (TH Soldering by Solder Paste) Mass Production Special tooling design PCB, Assembly Component Failure Analysis