PCB Layout: DFA (Design for Assembly) PCB Assembly Process & Reflow Soldering,Thermal Balancing considerations Component variety,component packaging,auto-insertable or auto placeable components,Two-sided component placing,component orientation & placement,component PAD (Foot Print Design) & trace width according to process capability,pad & trace spacing,Panel sizes (No’ of Boards), tooling holes,panel ordination.Special tooling design for Mass production assembly process

PCB Stackup Design: PCB Raw material Specification Selection for (Flex-Rigid/Rigid) Material Considering Loss Considerations,Relative Dielectric Constant,Loss Tangent,Material Cost Comparison VS System Design needs,Fiberglass Weave Styles,Glass Transition Temperature,Layers Assignment-PCB Stackup Construction,(Split planes/Isolation) partitioning,High-Speed Critical Nets-I/O,CLK & Diff Pairs Control Impedance Signal Integrity Design,Plane Layer Separation-Power Integrity Design,High-Current Power,High voltage to UL or ECC specification Clearances Design Rules,Copper Weight,Capacitance & Spreading Inductance-Noise-Coupling prevention-Decoupling & Bypassing,Power & Ground Planes,PCB Grounding RFI & EMI Design Rules for High Signal Integrity Simulation compliances

PCB DFM: PCB Technology & Engineering Layout Design Rules Parts Placement Rules,Component Traces Fan Out & via location VS Stackup Design Mechanical Via,Blind & Buried Vias,Laser Drilled Micro-Vias,Non-Plated & Plated Holes Via Plugging,Via Filling,Via Capping,Plated Through-Holes Trace Widths & Spacing Trace Via to Board Edge Solder Mask Cover & release from Via,Silkscreen/Legend Anti-Pad,Plane Relief,Thermals & copper balancing Fiducial Requirements,Depaneling,Tab Routing,Test Points

CAD Design file & Gerber files verification - QA Technological & Engineering Approvals